Efforts of the new processes

Low cost laser dicing. We can produce test cutting and mass production of Sapphire, Si, etc.

Laser dicer
(DFL7160)

Photos of after dicing
Experimental Laser light source

Chip dicing process by Plasma

[Offer for new process]
We can also produce plasma process dicing and total processing of patterning wafer and chip dividing for either prototype or entrusted mass manufacture.


Surface

Section
 

Chip size comparison with mass production product

 

※Please ask us for wafer patterning and plasma process as a development project.