Company information
Company resume
| Name of company | Enzan Seisakusho Co.,Ltd. |
|---|---|
| Establish | 1953 |
| Capital | 40 million yen |
| President | Hiroshi Matsusaka |
| Number of employees | 60 |
| Business | Si and Compound wafer dicing ceramics dicing Si and Compound wafer back grinding from back materializing, and cutting |
| Area of site | (Head office)3000m2(clean room 760m2) (PDM center)3400m2(Clean room 500m2) |
| Location | (Head office) 276 Shimoozo Enzan Koshu Yamanashi TEL:0553(33)3136 FAX:0553(32)1152 (PDM center) 601-17 Todoroki Katsunuma Koshu Yamanashi TEL:0553(33)3136 FAX:0553(44)6031 |
| information@enzan.com | |
| URL | http://www.enzan.com/ |
History
| 1953.4 | Founded as Yoshida pump(Founder:Tomonori Yoshida) |
|---|---|
| 1959.3 | Started to sell home appliances as Enzan Hitachi Shokai. |
| 1967.11 | Produced semiconductor as a support manufacturing plant for Hitachi Manufacture & Toyo Electronics KK. |
| 1987.9 | Increased capital to 20 million yen. |
| 1988.9 | Established new dicing department(337m2),started Hitachi diode dicing operation. the dicing factory name is Maekouteijigyojo and the sorting-inspecting factory name is Atokouteijigyojo. |
| 1991.4 | Expanded the dicing factory.(300m2) |
| 1994.11 | Started IC dicing process production. |
| 1995.3 | Started compound semiconductor dicing process production. |
| 1995.8 | Closed down the Atokouteijigyojo. |
| 1995.10 | Started ceramic dicing process production. |
| 1997.1 | Started total production of dicing from back grinding to back metal plating. |
| 1998.7 | Introduced Au planting operation. |
| 1999.12 | Introduced back polisher. |
| 2001.12 | Approved ISO9001,Ver 2000. |
| 2002.7 | Increased capital to 40 million yen. |
| 2003.10 | Completed Process Development Manufacturing center. |
| 2004.4 | Started mass production at PDM center. |
| 2005.1 | Approved ISO14001. |