Wafer dicing

We will take care of semiconductor dicing!

Why is there a yield loss happening when you take the wide dice street?

  • Up to 35μm is available for mass production
A wafer attached to
dicing tape
After dicing Small chip of kerf
width 35µm
Mutilated chip product

Do you have a problem with throughput degradation?

  • We can mass produce with 120mm/sec

Cutting time if we changed 80(mm/sec)⇒120(mm/sec) for 250µm □ chip = 150%UP

Is there a problem with time consumption and cost up due to the extra step of cut to control chipping?

  • We can mass produce with low cost by Half cut + Breaking.
Half cut + Breaking System Original developed fully automatic braking equipment.
Original developed fully
automatic braking equipment.

Dicing method

Dicing method

※Change step cut to one pass cut ⇒ Also saves time of 2 spindle dual cutting

Do you have a problem with chipping back side?

  • • We can make chipping back side less than 30µm.
Ability of the distribution of chipping back side A picture for observing back side chipping
Ability of the distribution of
chipping back side
A picture for observing
back side chipping

Do you have a problem with increase flexural strength?
Do you have trouble with the variation or decrease in the flexural strength or do you want to keep the chip strength?

  • • We can manage dicing and back side process specification to increase flexural strength.

Distribution of flexural strength

Do you have a problem with cutting difficult materials to cut and dice?

  • We can provide a variety of ways of processes such as the way of holding works (tape, wax, etc…) and a variety of materials (resin, metal, electroplating, etc..)

①We can increase the acquisition rate by ensuring kerf width 60µm, chipping less than 15µm
  and chip size 250 µm for GaAs products.

②Do you have a problem of InP chip lacking and chipping?
  We also provide InP dicing service with high yield based on our long time experience.

③Other electronic materials
  We have a test cutting system to process new condition prototype products such as Ceramics,
  GaN, SiC, sapphire and other new materials.


Resin blade

Fixing work piece with tape

Metal blade

Fixing work piece with wax

Electro-casting blade