Semiconductor fabrication process list

Our process list

Our process list

List for available BG thin process

Our achievement in mass production

List for available BG thin process

Sputtering specification

Our achievement in mass production

Sputtering specification

◆We use a sputter to process backside metalworking.


Au Plating specification

Our achievement in mass production

Au Plating specification

◆For Au plating, we use an electroplating solution that does not use cyanide plating solution that is environmentally friendly.


Dicing specification

Half cut

Half cut

 

Full cut

Full cut

◆Our achievement in mass production is chip size
   Si ⇒ Over 0.15mm square, GaAs and Inp ⇒ 0.25mm square.