achievements of applications
Dicing
Dicing processing of various kinds of wafers
Dicing processing of various kinds of election materials
1. A way of cutting
The way of dicing cut is generally divided into 2 ways(Full cut and half cut).
We offer proper applications,adjusted quality of processing and products.
Note:The way of half cutting can divide the small chip 0.25mm by cracking equipment developed by our own company.
It can be also diced into a big diameter wafer,12 inches.
We can get mass production by dicing very thin wafers without lowering resister and refraction strength.
GaAs, 30μ thickness wafer can be diced if it has back metal as reinforcement material.
The way of chip delivery processing
After dicing is finished, it is possible to deliver packed chips in various kinds of chip trays.
Chip tray deliver/Wafer size/Tray size
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